Pillarhouse Jade S-200 Selective Solder System using RoHS Materials

Selective Soldering is the process by which conventional leaded components are soldered onto a printed circuit board. This process is usually conducted after the surface mount reflow soldering operation. With the increasing popularity of Lead Free solder and its associated high cost to fill a large conventional wave solder machine bath, Selective Soldering offers a significantly lower cost approach with inherently smaller bath design and the added advantage of quick change capabilities i.e. from lead free to eutectic and vice versa.

It is often necessary to process leaded components which are in a very close proximity to surface mounted parts. Selective Soldering offers the ability to accurately control a nozzle flow under nitrogen inertion so that parts can be soldered without any damage to the nearest surface mount devices. In some cases we can solder points as close as 1mm to the nearest surface mount component, thus offering a highly flexible and cost effective solution.

Contact System Component Locator with Cut Clinch
Electrovert Econopak I Wave Solder
Aqueous Cleaning System Model 9300 with internal deioinized water generation
Forming Equipment
Selective Soldering Fixtures

The soldering iron tip is automatically programmed to accurate tip temperature setting simply by inserting it into the process gate (patent pending feature)